Other examples for the 3D printing of traditional semiconductor devices include the fabrication of certain sensors and micro-electromechanical systems (MEMs). Emerging 3D printing technologies like digital light processing (DLP) offer the high theoretical resolutions needed to compete with older (above 130 um) semiconductor process nodes. Conversely, DLP techniques do have trouble dealing with microscale voids and channels without causing clogging.

Researches from the Singapore University of Technology and Design (SUTD), Southern University of Science and Technology (SUSTech) and Zhejiang University (ZJU), have proposed a generic process flow for guiding DLP 3D printing of miniature pneumatic actuators for soft robots with an overall size of 2-15 mm and feature size of 150-350 μm. (Note that 150 um is close to the 130 um process geometries still used in the semiconductor world for many low-cost IoT chips.) A soft debris remover with an integrated miniature gripper is used to navigate through a confined space and collection of small objects in hard-to-reach positions.