W. L. Gore & Assoc.'s GORETM Low-Profile Copper Cable

W. L. Gore & Assoc. Inc.'s very low-profile QSFP direct attach copper cable assembly is "fiber-like" in size for QDR InfiniBand and 40 GbE aggregate applications. GORE^TM Low-Profile Copper Cable fulfills the needs of dense, higher-port-count switch installations while providing an even more reliable interconnect for high-performance computing (HPC). This cable was provided to major switch vendors and computing OEMs for testing over the last six to eight months and was tested for compliance and interoperability in spring 2009. The reduced bend radius and smaller diameter of GORE^TM Low-Profile Cable allow for more aggressive routing as well as cleaner dressing of the cables in high-performance computing (HPC) environments. This new cable is also less prone to interfere with the closing of cabinet doors in dense environments. The data centers and OEMs continue to reinforce that the reduction in cable mass provides greater air flow for more efficient cooling, which results in increased electronic efficiencies and reduced failures; this is a benefit that is sometimes overlooked. GORE^TM Low-Profile Copper Cable was developed for GORE^TM QSFP Assemblies and InfiniBand QDR applications. With a diameter of 0.170 inch for a 4x channel, eight-pair cable, the cross-section savings is 37 percent compared to alternative Gore cables and 58 percent compared to typical industry offerings. This low-profile cable is targeted at high-performance computing applications, where a large percentage of high-density port-count interconnects are 2m or less (e.g., in top-of-the-rack switching installations).

For more information: http://www.gore.com/en_xx/products/cables/copper/networking/Infiniband/infiniband-qsfp.html?xcmp+ejr_QSFPpr_0709