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HomeCEC ArchiveCEC Semester Two 2012Embedding USB Technology: Limitations, Challenges & ComplianceNov 27 - Day 2: USB Over a Single Wire Pair

Nov 27 - Day 2: USB Over a Single Wire Pair

Day 2 presents the methods and circuitry used in USB 1.1 and USB 2.0 to transmit and receive data over a single wire pair. The methods for USB 3.0 are also presented. The physical layer is examined. For compliance purposes, it is often sufficient to follow the semiconductor vendor reference designs.
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Start Date: Nov 27, 2012 - 06:00 PM UTC

Day 2 presents the methods and circuitry used in USB 1.1 and USB 2.0 to transmit and receive data over a single wire pair. The methods for USB 3.0 are also presented. The physical layer is examined. For compliance purposes, it is often sufficient to follow the semiconductor vendor reference designs.

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