DesignCon 2025: The Place Engineering Speakers Meet

Become an industry-expert speaker—or continue to be one! Start by submitting your ideas to the DesignCon Call for Abstracts.

Naomi Price

May 22, 2024

3 Min Read
DesignCon women in engineering
Melinda Picket-May, Professor at University of Colorado, Boulder, leads a DesignCon 2024 panel on women in engineering. Joining her were (l to r) Maria Agoston, with Tektronix; Zhen Mu, with Cadence Design Systems; Diksha Singh, with Achronix Semicondustors; and Marianne Nourzad with Intel.DesignCon

Whether you are already an expert hardware or automotive engineering speaker or want to take the first step to becoming one, you should be at DesignCon, the premier educational conference and technology exhibition for semiconductor and electronic design engineers. With a strong culture of networking among peers, the event provides an easy way to connect with others in your industry niche.

DesignCon wants our new paper authors to succeed! We offer mentoring for first-time lead authors, and this year we are also offering mentoring for first-time Call for Abstract submitters. See sign-up information below. 

DesignCon has announced the 2025 Call for Abstracts. Submissions can be made for technical papers, panels, tutorials, and boot camps. At DesignCon, engineers connect with engineers to find practical solutions to the challenging problems they share in design and verification. The conference emphasizes education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies. Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews.


DesignCon 2025 will take place January 28 to 30, in Santa Clara, CA. Between now and June 20 you have the opportunity to submit your proposal to present a 45-min technical session, which includes completion of a full technical paper, or a 75-min panel discussion, 2.5-hr tutorial, or full-day boot camp to be presented at the conference. Everyone is welcome to submit multiple abstracts.

With 14 tracks, DesignCon covers all aspects of hardware design, including high-speed serial design, signal & power integrity, interconnect modeling & analysis, and machine learning. Please look through the entire track list (halfway down the page) to choose the most appropriate track for your submission. You can also submit to speak at Drive World at DesignCon, bringing together the brightest minds across advanced automotive electronics and EV engineering.

DesignCon abstracts will be reviewed by industry experts from the Technical Program Committee (TPC) and evaluated based on quality, relevance, impact, and originality. Submissions should be educational, informative, and avoid commercial content. 

New to authoring a technical paper? DesignCon’s mentorship program is ready to help you succeed. The TPC provides mentoring for new and early-career lead authors. We are pleased to announce that this year, new submitters can also receive mentoring to assist you to submit the best abstract possible. Contact conference director Naomi Price if interested ([email protected]). 

Session formats:

  • Technical Paper Sessions require the authorship of a full technical paper up to 25 pages in length addressing design case studies and application overviews and are presented in 45-minute sessions. Papers are not required for Drive World technical sessions.

  • Technical Panels: 75-minute discussions featuring 3-5 panelists plus a moderator to drive the discussion. 

  • Tutorials: 2.5-hour sessions, allowing the speakers to cover core topics in greater depth. 

  • Boot Camps: full-day sessions that provide an in-depth introduction to core DesignCon concepts such as Signal Integrity, Power Integrity, PCB Fabrication, and Test & Measurement. Please note that there are a very limited number of Boot Camp slots. 

  • Chiphead Theater sessions provide less-technical, more interactive content such as teardowns, demos, and panels presented as 45-minute sessions on the expo floor and are open to all attendees.

Submit your proposal now, before the June 20 deadline. 

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