Innovative, high-speed chip designs were unveiled at the recent Hot Chips Conference in Silicon Valley.

Spencer Chin, Senior Editor

September 2, 2022

4 Slides

The Hot Chips conference was recently held in Silicon Valley. This virtual engineering conference highlighted some of the latest advances in chip technology, with presentations by leading semiconductor and electronics companies.

Not surprisingly, the chip designs revealed will shape the future of processors in the coming years, as applications such as artificial intelligence, machine learning, and other high-speed computing place even more stringent demands on handling data. Here are some highlights from this year’s conference.

Spencer Chin is a Senior Editor for Design News covering the electronics beat. He has many years of experience covering developments in components, semiconductors, subsystems, power, and other facets of electronics from both a business/supply-chain and technology perspective. He can be reached at [email protected].

About the Author(s)

Spencer Chin

Senior Editor, Design News

Spencer Chin is a Senior Editor for Design News, covering the electronics beat, which includes semiconductors, components, power, embedded systems, artificial intelligence, augmented and virtual reality, and other related subjects. He is always open to ideas for coverage. Spencer has spent many years covering electronics for brands including Electronic Products, Electronic Buyers News, EE Times, Power Electronics, and electronics360. You can reach him at [email protected] or follow him at @spencerchin.

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