Epoxy suits medical applications

July 6, 1998

1 Min Read
Epoxy suits medical applications

Master Bond Inc.'s EP30 Medical meets USP Class VI specifications and is suited for use in reusable and disposable medical devices. For bonding, sealing, and encapsulation, the low-viscosity, high-performance, two-component epoxy system cures at room temperature or more quickly at elevated temperatures. It has a convenient 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond says the epoxy offers remarkable resistance to chemicals (including water, oil, and most organic solvents) and cold sterilants, as well as ETO and gamma radiation. It has a service operating temperature range of -60 to 250F. Master Bond Inc. Product Code 4323

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