Select Reliable Connectors for Mobile Devices

Tolerates mechanical forces. The board-to-board and board-to-FPC connections within mobile devices have to withstand substantial forces, from insertion forces during assembly to shock and vibration forces in use. A robust contact geometry is the first line of defense against these forces.

Contains the solder. The low-profile connectors used in mobile devices are susceptible to damage from solder rise. The best connectors will provide an integrated nickel barrier to keep the solder in its place.

Resists corrosion. Corrosive gases generated during the assembly process can damage connectors, ultimately shortening their life. Look for connectors with an anti-corrosion surface treatment.

Stays in alignment. Coplanarity of the connector pins may not be the most obvious product selection factor, but it directly affects insertion force and the connector's ability to withstand repeated insertions. Look for connectors with the best coplanarity specs.

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