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EpoxySet introduces EPOXIOHM EO-32HTK, silver-filled epoxy with exceptionally high thermal conductivity. This unique system offers extreme thermal management capabilities in high-power and high brightness LEDs. Designed for use in microelectronics, it is excellent for heat dissipation in chip bonding and optoelectronic applications.
Once cured, this system is resistant to thermal cycling from -55 to 300°C with high impact resistance. It can easily be applied with silk screening, transfer printing, or automated dispensing equipment. EO-32HTK can be cured as low as 80°C in 2-3 hours. With cures of 150°C in 15 minutes, it achieves a thermal conductivity of 12.4 W/m°K. It is a very low electrical resistance adhesive with a volume resistivity of 10-4 Ohm-cm. Low ionic impurities make it the best choice for any sensitive electronic application.
