IPC revision of surface mount design standard expands lead-free coverage

The Association Connecting Electronics Industries (IPC) has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Patter Standard. IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

The B revision of the standard expands its lead free coverage with the addition of new solder alloys and presents thoughtful discussion on etch-factor compensations at the designer level as well as at printed board fabrication. In addition, IPC-7351 has been edited significantly by users of the standard to enhance its clarity and understanding.