High-Frequency Center Probe Test Sockets

Aries Electronics' machined high-frequency center probe test sockets accommodates IC devices with a leadpitch of 0.30 mm. With low inductance and capacitance, the sockets are usefulfor a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.

Point crown orsharp point gold plated 0.30 mm pitch probe pin, spring and flanged bottom pincontacts the tail of the probe pin to shorten the signal path. A signal path of0.077 inches (1.96 mm) allows for minimal signal loss and higher bandwidthcapacity with the Aries' machined high-frequency sockets.

The solderlesspressure mount spring probes allow easy mounting of the socket to a test boardand device solder ball or pad, while socket locating posts allow accuratepositioning of the socket to the board. The sockets are equipped with chipguides to allow exact device location and four-point edge male contacts forprecise mating of the device.

Spring loadedcontacts, made of gold-plated beryllium copper, provide a high life cycle of upto 500,000 cycles. Socket body material is Torlon PAI and all hardware isstainless steel.

The socket'scontact forces are 15 g per contact on a 0.30 to 0.35 mm pitch, 16 g percontact on a 0.40 to 0.45 mm pitch and 25 g per contact on a 0.50 mm pitch orlarger. Contact resistance is less than 40 milliohms. Probe self-inductance onthe new socket is 0.51 nH for large probes and 0.59 nH for small probes.

The socketaccepts solder ball sizes from 0.15 to 0.93 mm. Insertion loss is 1 dB to 10.1GHz for a larger probe at 0.80 mm pitch and 1 dB to 18.7 GHz for a smallerprobe at 0.50 mm pitch.

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High-Frequency Center Probe Test Sockets