Who's Speaking at DesignCon's Spring Break Webinar Series?

Engineers will gain insights into several hot tech topics during DesignCon's Spring Break webinar series.

John Blyler

March 26, 2021

3 Min Read
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DesignCon’s Spring Break five-session webinar series is bringing top engineering thought leaders to the virtual table. Engineers will have the opportunity to take in practical insights and solutions to design the next generation of technologies for the electronics chip, board, and system industries.

Each session will walk through use cases, propose various tools for solving a range of design problems, and expand the attendee's understanding of key engineering principles.

In addition to gaining technical insights, all five webinars are free to attendees. Plus, every attendee will receive a discount code to join us at DesignCon’s annual in-person conference, August 16-18, 2021, at the San Jose McEnery Convention Center. Register for any of the five webinars by April 9 and receive information on an online networking opportunity with select speakers from the DesignCon community.

Here's a quick overview of the topic areas and what attendees will learn from participating in each webinar:

1) PCB Fabrication: What SI/PI Engineers Need to Know for First Time Modeling Success

Monday, April 12, 2021, 01:00 PM EDT

When you attend this webinar, you will learn:

  • The PCB fabrication process and associated SI/PI simulation modeling implications;

  • Conductor roughness and its effect on dielectric constant, characteristic impedance, phase delay, and insertion loss;

  • Cannonball-Huray roughness model and how to apply it in several EDA software tools;

  • How to extract and apply the right material properties from manufacturers’ data sheets to use for successful high-speed channel modeling;

  • Advantages and pitfalls of PCB stack-up on power integrity.

Related:The Future Of Signal And Power Integrity Designs

2) 400 Gbps & Beyond Optical Transceiver Design Considerations

Tuesday, April 13, 2021, 01:00 PM EDT

When you attend this webinar, you will learn:

  • A basic understanding of optical transceivers;

  • Design considerations for 400/800-Gbps transceivers;

  • Design, packaging, and integration challenges of integrated optical engines.

3) Power Integrity: Analyze Impedance to Improve Power Delivery, SI & EMI

Wednesday, April 14, 2021, 01:00 PM EDT

When you attend this webinar, you will:

  • Learn how to reverse engineer target impedance to generate requirements for the VRM’s active inductance and the load’s package/die capacitance;

  • Watch how flat impedance design improves design margins over component tolerances and avoids the disaster of a rogue voltage wave arriving at the load;

  • Explore advanced PI ecosystem time-domain simulations with EM PCB models to understand Power Supply Rejection Ratio (PSRR) and the potential sources for conducted EMI.

Related:2021 Trends Foreshadowed in 2020 Tech Awards

4) Controlling the Waves: A Field-based Perspective on High-speed PCB Design

Thursday, April 15, 2021, 01:00 PM EDT

When you attend this webinar, you will:

  • The basic behavior of EM fields as they move through the PCB and ways to control them;

  • The most important characteristics of the ICs in the design that affect the PCB layout requirements;

  • How to create an effective board stackup;

  • How to use these characteristics to define the PDN component selection and placement, as well as the interconnects needed to create the transmission lines that support these requirements;

  • How to use these characteristics to define the transmission lines that carry the high-speed signals.

5) OEM Roundup 2021: The New ADAS

Friday, April 16, 2021, 01:00 PM EDT

When you attend this webinar, you will learn:

  • What OEMs see as the biggest gap of driving automation and how ADAS will fill it;

  • Timeline expectations for L2+/L2++ ADAS system roll-out;

  • The systems that will make the biggest differences in user experience.


About the Author(s)

John Blyler

John Blyler is a former Design News senior editor, covering the electronics and advanced manufacturing spaces. With a BS in Engineering Physics and an MS in Electrical Engineering, he has years of hardware-software-network systems experience as an engineer and editor within the advanced manufacturing, IoT and semiconductor industries. John has co-authored books related to RF design, system engineering and electronics for IEEE, Wiley, and Elsevier. John currently serves as a standard’s editor for Accellera-IEEE. He has been an affiliate professor at Portland State Univ and a lecturer at UC-Irvine.

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