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Submissions Are Open to Speak at DesignCon 2024

Get noticed by the design engineering community. Start by submitting your ideas to the DesignCon Call for Abstracts.

Naomi Price

May 12, 2023

2 Min Read
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Image courtesy of Informa Markets – Engineering

DesignCon, the premier educational conference and technology exhibition for semiconductor and electronic design engineers, has announced the 2024 Call for Abstracts. Submissions can be made for technical papers, panels, tutorials, and boot camps. At DesignCon, engineers connect with engineers to find practical solutions to the challenging problems they share in design and verification. The conference emphasizes education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies. Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews.

DesignCon 2024 will take place January 30 to February 1, in Santa Clara, CA. Between now and June 29 you have the opportunity to submit your proposal to present 45-minute technical sessions, which include completion of a full technical paper, or a 75-minute panel discussion, 2.5-hour tutorial, or full-day boot camp to be presented at the conference. Everyone is welcome to submit multiple abstracts.

With 14 tracks, DesignCon has information covering all aspects of hardware design, including high-speed serial design, signal and power integrity, interconnect modeling and analysis, and machine learning. Please look through the entire track list (halfway down the page) to choose the most appropriate track for your submission.

Each abstract will be reviewed by industry experts from the Technical Program Committee (TPC) and evaluated based on quality, relevance, impact, and originality. Submissions should be educational, informative, and avoid commercial content.

New to authoring a technical paper? DesignCon’s mentorship program is ready to help you succeed. The TPC offers mentors for new and early-career lead authors. More information will be provided once your submission is accepted.

Session formats:

  • Technical Paper Sessions require the authorship of a full technical paper up to 25 pages in length addressing design case studies and application overviews and are presented in 45-minute sessions.

  • Technical Panels: 75-minute discussions featuring 3-5 panelists plus a moderator to drive the discussion.

  • Tutorials: 2.5-hour sessions, allowing the speakers to cover core topics in greater depth.

  • Boot Camps: full-day sessions that provide an in-depth introduction to core DesignCon concepts such as Signal Integrity, Power Integrity, PCB Fabrication, and Test and Measurement. Please note that there are a very limited number of Boot Camp slots.

  • Chiphead Theater Sessions provide less-technical, more interactive content such as teardowns, demos, and panels presented as 45-minute sessions on the expo floor and are open to all attendees.

Submit your proposal now, before the June 29 deadline.

 

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