Key Takeaways from DesignCon 2024

Chiplets, high-speed processor standards, thermal analysis, and electric vehicles were hot areas of discussion and presentations at the recent DesignCon.

Spencer Chin, Senior Editor

February 5, 2024

5 Slides

The busy show floor at this year’s DesignCon Show in Santa Clara, CA was indicative of an engineering community starved to learn about the latest developments in electronics related to signal integrity and other issues. Ongoing development of advanced vehicles, robotics, IoT, and AI and high-speed computing systems are keeping engineers busy looking for the latest technologies and learning the latest design techniques to develop next-generation products and systems that will be reliable and provide the high performance now expected.

Some of the key trends follow in the gallery below. Design News will also publish more detailed stories on some of the trends and issues in coming days.

About the Author(s)

Spencer Chin

Senior Editor, Design News

Spencer Chin is a Senior Editor for Design News, covering the electronics beat, which includes semiconductors, components, power, embedded systems, artificial intelligence, augmented and virtual reality, and other related subjects. He is always open to ideas for coverage. Spencer has spent many years covering electronics for brands including Electronic Products, Electronic Buyers News, EE Times, Power Electronics, and electronics360. You can reach him at [email protected] or follow him at @spencerchin.

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