Stacked Modules Hold Flash, RAM

As portable products such as cell phones and PDAs do more tasks and handle more data, they require more memory space. Atmel Corp. is addressing this burgeoning demand with a family of memory modules that have both Flash and RAM stacked inside.

Storage capacity ranges from 16 Mbits of Flash and 8 Mbits pseudo static RAM up to 128 Mbits of Flash and either 32 or 64 Mbits of PSRAM.

The package size measures only 8 × 10 mm. The modules come in a 67- ball ceramic ball grid array or an 88-ball CBGA package. Both packages have the same dimensions, simplifying upgrades in memory capacity. System designers can allot the same amount of board space for memory and provide different options for users.

The 64 and 128 Mbit flash modules offer page mode, burst mode, and concurrent read capabilities. The latter feature lets the module read from one Flash plane while the chip is being programmed or data is being erased. Each Flash chip can have from four to 32 planes, giving designers many options for moving and storing data.

Both PSRAM and Flash memory are configured in 16-bit words. PSRAM offers benefits of both dynamic and static RAM, reducing power consumption while providing high memory capacity.

The modules have 70 nsec read times. The page access time is 25 nsec, while the burst transfer rate is 66 MHz. Power consumption is 27 mA while operating, dropping to 53 µA when it goes into a standby mode. The chips operate with either 2.7 or 1.8V power supplies.

Operating temperatures range from -25 to 85C. In quantities of 10,000, pricing starts at $3.95 for the 16+8. Atmel Corp.http://rbi.ims.ca/4386-576