Thermally Conductive Epoxy
December 16, 2010
Master Bond's EP21ANHT isa highly thermallyconductive epoxy system that is specially designed to help mitigate theissues associated with tightly packed components and miniaturized electroniccircuits. With a thermal conductivity over 22 BTU/in/ftA 2/hr/F andserviceability from -60 to 400F, Master Bond EP21ANHT can be used inmicroelectronic applications. The cured adhesive is also an electricalinsulator.
This two component adhesive, sealant and coating has a 1 to 1 mix ratio byweight or volume and offers room temperature and faster elevated temperaturecures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/C,a dielectric strength of >400V/mil and a tensile shear strength greater than1,000 psi. It resists a wide range of chemicals and adheres well to a variety ofsubstrates.
EP21ANHT is available in pint, quart, gallon and 5 gallon kits.
Thermally Conductive Epoxy
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