Tflex SF600 DF Silicone-Free Thermal Gap Filler

DN Staff

October 28, 2010

1 Min Read
Tflex SF600 DF Silicone-Free Thermal Gap Filler

Thepad offers a compliant, silicone-free elastomer gap filler designed to providemoderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0W/mK.

Availablein thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inchincrements, this soft interface pad conforms with minimal pressure, resultingin minimal thermal resistance even at low pressure with little or no stress onmating parts. It also includes differential tack on one side and is dry to thetouch on the other side.

The TflexSF600 DF passes "cleanliness" testing requirements and is rated forInternational Disk Drive Equipment and Manufacturing Association (IDEMA)M11-99, M7-98, M12-99, and M13-99 standards. The gap filler pad is RoHScompliant and is certified to UL 94V0 flammability rating.

Sign up for the Design News Daily newsletter.

You May Also Like