Sponsored By

3D Printing of Integrated Circuits: Four Trends You Need to Know

Is 3D printing technology ready to challenge the semiconductor chip fab market?

John Blyler

March 12, 2020

4 Slides

RELATED ARTICLES:

John Blyler is a Design News senior editor, covering the electronics and advanced manufacturing spaces. With a BS in Engineering Physics and an MS in Electrical Engineering, he has years of hardware-software-network systems experience as an editor and engineer within the advanced manufacturing, IoT and semiconductor industries. John has co-authored books related to system engineering and electronics for IEEE, Wiley, and Elsevier.

About the Author(s)

John Blyler

John Blyler is a former Design News senior editor, covering the electronics and advanced manufacturing spaces. With a BS in Engineering Physics and an MS in Electrical Engineering, he has years of hardware-software-network systems experience as an engineer and editor within the advanced manufacturing, IoT and semiconductor industries. John has co-authored books related to RF design, system engineering and electronics for IEEE, Wiley, and Elsevier. John currently serves as a standard’s editor for Accellera-IEEE. He has been an affiliate professor at Portland State Univ and a lecturer at UC-Irvine.

Sign up for the Design News Daily newsletter.

You May Also Like