DesignCon, premier event for chip, board, and systems design engineers, announces the top rated papers from the 2018 conference. DesignCon 2019 Call for Abstracts Opens Mid-May 2018.
Do you know an engineer who goes above and beyond in the advancement of their field? It’s time to nominate them for the 2018 DesignCon “Engineer of the Year” Award.
Calling all Chipheads: We want you on the podium in 2018! Share your engineering smarts with your peers at DesignCon – start by submitting your plans to our 2018 Call for Abstracts.
Heidi Barnes was selected by her peers to be the 2017 DesignCon Engineer of the Year based on her achievements in the signal integrity (SI) and power integrity (PI) industry, as well as Services to the DesignCon community.