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Future Chips Emerge at Hot Chips Conference

Gallery-Future Chips Emerge at Hot Chips Conference

Intel's Xeon D-2700 series chips use a tile-based design with discrete CPU, GPU, SoC and I/O tiles stacked in 3D configurations.
Innovative, high-speed chip designs were unveiled at the recent Hot Chips Conference in Silicon Valley.

The Hot Chips conference was recently held in Silicon Valley. This virtual engineering conference highlighted some of the latest advances in chip technology, with presentations by leading semiconductor and electronics companies.

Not surprisingly, the chip designs revealed will shape the future of processors in the coming years, as applications such as artificial intelligence, machine learning, and other high-speed computing place even more stringent demands on handling data. Here are some highlights from this year’s conference.

Spencer Chin is a Senior Editor for Design News covering the electronics beat. He has many years of experience covering developments in components, semiconductors, subsystems, power, and other facets of electronics from both a business/supply-chain and technology perspective. He can be reached at [email protected]

TAGS: Electronics
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