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Thermally Conductive Epoxy

Thermally Conductive Epoxy

Master Bond's EP21ANHT is a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU/in/ftA 2/hr/F and serviceability from -60 to 400F, Master Bond EP21ANHT can be used in microelectronic applications. The cured adhesive is also an electrical insulator.

This two component adhesive, sealant and coating has a 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/C, a dielectric strength of >400V/mil and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.

EP21ANHT is available in pint, quart, gallon and 5 gallon kits.

Thermally Conductive Epoxy
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