Master Bond's EP21ANHT isa highly thermallyconductive epoxy system that is specially designed to help mitigate theissues associated with tightly packed components and miniaturized electroniccircuits. With a thermal conductivity over 22 BTU/in/ftA 2/hr/F andserviceability from -60 to 400F, Master Bond EP21ANHT can be used inmicroelectronic applications. The cured adhesive is also an electricalinsulator.

This two component adhesive, sealant and coating has a 1 to 1 mix ratio byweight or volume and offers room temperature and faster elevated temperaturecures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10^-6/C,a dielectric strength of >400V/mil and a tensile shear strength greater than1,000 psi. It resists a wide range of chemicals and adheres well to a variety ofsubstrates.

EP21ANHT is available in pint, quart, gallon and 5 gallon kits.

Thermally Conductive Epoxy