The
pad offers a compliant, silicone-free elastomer gap filler designed to provide
moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0
W/mK.
Available
in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch
increments, this soft interface pad conforms with minimal pressure, resulting
in minimal thermal resistance even at low pressure with little or no stress on
mating parts. It also includes differential tack on one side and is dry to the
touch on the other side.
The Tflex
SF600 DF passes "cleanliness" testing requirements and is rated for
International Disk Drive Equipment and Manufacturing Association (IDEMA)
M11-99, M7-98, M12-99, and M13-99 standards. The gap filler pad is RoHS
compliant and is certified to UL 94V0 flammability rating.
Tflex SF600 DF Silicone-Free Thermal Gap Filler
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