Master Bond's EP21TDCS-LOis an electrically conductive silver-filled epoxy that passes ASTM 595 for NASAlow outgassing specifications. The adhesive cures at room temperature in 24-48hours and in 1-2 hrs at 200F. It features a tensile shear strength of more than1,800 psi, a T-peel of greater than 5 pli and adhesion to similar anddissimilar substrates. The volume resistivity of the system is less than 10^-3ohm-cm. Serviceable over the range of 4K to 275F, EP21TDCS-LO is suitable forcryogenic applications. It withstands thermal cycling and is resistant tochemicals, including water, oil and most organic solvents.

The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With itslow drip formula, EP21TDCS-LO can be conveniently applied with a syringe,knife, spatula or trowel to vertical surfaces without sagging and only contactpressure is required for curing. Syringes have a 3 month shelf life and glassjars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO isavailable in premixed and frozen syringes, as well as in metal containers. Itis widely used for applications in the electronic, electrical, computer,semiconductor, aerospace and optical industries.

Silver Conductive Epoxy