IBM plans to eliminate by the end of this year all internaluses of perfluorooctanoic acid (PFOA) and perfluoroooctanesulfonic acid (PFOS).

These materials have been used for wafer patterning andetching processes, and are most commonly used as stain repellants. IBM's ban is"based on growing evidence of the persistent bioaccumulative and toxicproperties," IBM states in its just-released Corporate Responsibility Report.

IBM is replacing PFOA and PFOS with next-generation,fluorine-free photolithographychemicals. The banned chemicals wereeliminated last year from wet-etch processes in New Yorkand Vermontplants.

IBM has issued corporate responsibility reports since2002 to monitor its progress on environmental, supply chain and other goals. "Buildinga smarter planet isn't simply a recipe for economic growth; it's also a recipefor radically expanded economic and societal opportunity," says CEO Samuel J.Palmisano.

Voluntary materials prohibitions and restrictions by IBMdate to 1978 when polychlorinated biphenyls (PCBs) were banned. Use ofpolyvinyl chloride has been prohibited from system enclosure parts in newproducts after 2007. A full list of materials prohibitions follows:

IBM Bans Wafer-Etching Acids A