2019 IEEE IEDM event reveals latest node chips, chiplets, memories for AI, densest thin-film batteries, 400Gbits/s silicon photonics, quantum computing tools and much more.
While we celebrate the positive impacts of artificial intelligence let's not forget there's also a lot to be concerned about.
Silicon photonics, fiber optic communications, design for chip-IP security and microsystems in NASA’s SOFIA project are just a few of the topics covered.
Hydrails, hydrogen-fueled locomotives and railcars, could be the alternative to a prohibitively expensive electrified infrastructure, and the way forward for the hydrogen economy.
Get the history of Science Technology Engineering and Math (STEM) from this amazing demonstration of progress from the cave to space.
Cast your vote for the 2020 DesignCon Engineer of the Year. Let us know which of our six finalists you think should be the winner before noon PT on December 27, 2019.
Facing disappointing sales of its augmented reality headset, Magic Leap is targeting a new customer base – engineers.