Microcomputer packaging systems

Ripac subrack and microcomputer packaging systems feature maximum airflow subracks for improved convective flowthrough cooling, requested high pincount self-locking injector/ejector handles with optional microswitch for H-P forces, and user-programmable keying, with more than 4,000 possible combinations. The systems are also for CompactPCI and VME 64 Ext. system requirements. Cutouts, special sizes, and custom configurations are all available.

Rittal Corp., 1 Rittal Pl., Springfield, OH 45504, FAX (937) 390-5599.