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Adhesive 21013
August 3, 1998
1 Min Read
ABLEBOND(reg) 8510B electrically conductive die-attach adhesive for ball-grid array semiconductor packages adheres large die to bare laminate, gold, solder masked, or copper oxide surfaces. This epoxy cures in 15 min at 150C. Advances in Die Attach Technology for Plastic Ball Grid Array Packages technical paper features this product.
Ablestik Laboratories, 20021 Susana Rd., Rancho Dominguez, CA 90221, FAX (310) 764-2545.
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