The PCB fabrication process and associated SI/PI simulation modeling implications;

Conductor roughness and its effect on dielectric constant, characteristic impedance, phase delay, and insertion loss;

Cannonball-Huray roughness model and how to apply it in several EDA software tools;

How to extract and apply the right material properties from manufacturers’ data sheets to use for successful high-speed channel modeling;

Advantages and pitfalls of PCB stack-up on power integrity.

A basic understanding of optical transceivers;

Design considerations for 400/800-Gbps transceivers;

Design, packaging, and integration challenges of integrated optical engines.

Learn how to reverse engineer target impedance to generate requirements for the VRM’s active inductance and the load’s package/die capacitance;

Watch how flat impedance design improves design margins over component tolerances and avoids the disaster of a rogue voltage wave arriving at the load;

Explore advanced PI ecosystem time-domain simulations with EM PCB models to understand Power Supply Rejection Ratio (PSRR) and the potential sources for conducted EMI.

The basic behavior of EM fields as they move through the PCB and ways to control them;

The most important characteristics of the ICs in the design that affect the PCB layout requirements;

How to create an effective board stackup;

How to use these characteristics to define the PDN component selection and placement, as well as the interconnects needed to create the transmission lines that support these requirements;

How to use these characteristics to define the transmission lines that carry the high-speed signals.

What OEMs see as the biggest gap of driving automation and how ADAS will fill it;

Timeline expectations for L2+/L2++ ADAS system roll-out;

The systems that will make the biggest differences in user experience.