Signal and Power Integrity Solutions in Abundance at DesignConSignal and Power Integrity Solutions in Abundance at DesignCon

Test equipment, connectors, and embedded hardware and software that solve vexing design issues at the recent DesignCon Show.

Spencer Chin, Senior Editor

January 31, 2025

4 Min Read
Molex's MMCX PoC connector ensures a stable connection while maintaining ground continuity.
Molex's MMCX PoC connector ensures stable, reliable contact while providing a smaller footprint than traditional MMC connectors.Molex

Connector tackles power over coax issues

Molex announced availability of its compact MMCX Power over Coax (PoC) solution, which features a patent-pending mating technique to ensure secure and stable connections while maintaining electrical ground continuity. This product innovation is ideally suited for space-constrained applications where reliable RF connections and continuous power delivery are paramount, such as automotive liquid-crystal display (LCD) mirrors, driver monitoring systems or industrial sensors.                                            The MMCX Power over Coax (PoC) is backward compatible with IEC 61169-52 MMCX jack receptacles to facilitate seamless product upgrades. This alleviates the need to redesign existing PCB receptacles, which can save time while reducing costs associated with product integration. Compliance with current and future standards offers customers a future-proof solution to meet evolving RF connection and power delivery requirements.

According to Molex, the compact product is 30% smaller than traditional MMC connectors, making it ideal for customers seeking to replace larger, heavier MCX connectors as well as more robust and reliable performance. MMCX Power over Coax is especially advantageous in applications where separate power and data connectors is either impractical or undesirable.

Related:Check Out These Innovations From DesignCon 2025

MultiLane demos 224Gbps/Lane instruments

The insatiable need for higher bandwidth and greater networking speeds, driven by AI and Machine Learning, has greatly accelerated the pace of development and deployment of next-gen networks. With 224Gbps/lane now considered an essential technology,  MultiLane showed 224Gbps/lane instrumentation to enable rapid, high-value host and module testing with scalable precision.

MultiLane’s latest Bit Error Rate Tester, ML7004F-L, was featured in a live demonstration recording the bit error rate of a 1.6Tbps (8x224Gbps) Active Electrical Cable, provided by 3M, The ML7004F-L is a 4-channel 120 Gbaud/lane PAM4 BERT which provided up to 35 dB of Rx equalization for long reach passive applications as well as retimed 1.6T optical modules and cables.

MultiLane’s Signal Integrity Analyzer, the ML8008FX-SIA, provides high-value testing for 224Gbps/lane passive and linear active cables, with ultra-fast testing for S-parameters and crosstalk and low total cost of ownership when validating any kind of custom passive or linear active interconnects such as Flyover Cables, DACs, ACCs, Backplane Cartridges, and Cable Trays. The ML8008FX-SIA’s ultra-high throughput capabilities are on full display in a multi-Terabit capable setup.

Related:Learn the Secrets of the Tesla Cybertruck at DesignCon 2025

PCIe 6.0 intelligent drivers

 TeraSignal showcased its PCIe 6.0 Intelligent Re-Driver solutions. The TS5602 Intelligent Re-Driver supports 4x64Gb/s PCIe connectivity and is available in a compact 7.25mm x 5.25mm FCLGA package as well as a flip chip bumped die. Key features include:

  • Over 50% power reduction compared to DSP-based retimers.

  • Low latency through DSP-free architecture.

  • Digital eye monitoring for real-time BER visibility on every link.

  • Automatic link training powered by TSLink software for streamlined setup.

  • Automatic receiver detection for PCIe use cases.

These Intelligent Re-Drivers can be deployed across server boards, riser cards, active copper cables (PCIe ACC), and active optical cables (PCIe AOC), making them ideal for emerging multi-rack server architectures.

Optical diagnostic interoperability at 112Gbps 

Synopsys demonstrated its Ethernet PHY IP enabling a linear pluggable optics (LPO) module diagnostic with Terasignal’s ultra-low power linear driver – the industry’s first optical diagnostic interoperability at 112Gbps.  

Low-power solutions are critical to support today’s data center infrastructures as growing compute demands present challenges with scalability, cost, and other crucial factors. This is crucial in enabling interoperability of LPO modules, paving the way for next-generation energy-efficient interconnects.  

Interconnect architecture for AI

Test solutions provider Keysight Technologies displayed next-generation interconnect architecture for high-performance AI clusters, which have rapidly advanced to 448 Gbps interfaces for 3.2Tbps systems. In a demo, Keysight highlighted its arbitrary waveform generator, which provides the versatility needed for complex real-world signal testing, enabling analysis and AI research.

Automated test solution

Test solutions provider Tektronix displayed an automated test solution for PCI Express 6.0 CEM Tx & Rx operating at 64 GT/s: The Tek DPO70000SX oscilloscope’s wizard-based user interface helped to create an automated test solution that simplifies complicated calibration and measurement of PAM-4 signaling.

PCI signal integrity solutions

Anritsu, in conjunction with Synopsys and Tektronix, demonstrated a system featuring the Anritsu MP1900A MU196020A PAM4 PPG to transmit the required 64 Gbaud PAM4 signal over a long-reach channel to Synopsys’ PCIe 7.0 PHY IP receiver for preliminary PCIe 7.0 evaluation.

Anritsu, using Synopsys’ PCIe 7.0 PHY IP and Tektronix’s RTO, will perform signal transmitter testing through SNDR measurements and waveform analysis at 128 GT/s. This integrated solution can be leveraged by engineers for initial PCIe 7.0 chip design and development with existing MU196020A PAM4 PPGs.

About the Author

Spencer Chin

Senior Editor, Design News

Spencer Chin is a Senior Editor for Design News, covering the electronics beat, which includes semiconductors, components, power, embedded systems, artificial intelligence, augmented and virtual reality, and other related subjects. He is always open to ideas for coverage. Spencer has spent many years covering electronics for brands including Electronic Products, Electronic Buyers News, EE Times, Power Electronics, and electronics360. You can reach him at [email protected] or follow him at @spencerchin.

Sign up for Design News newsletters

You May Also Like