DesignCon 2025 Welcomes the Next Generation of EngineersDesignCon 2025 Welcomes the Next Generation of Engineers
These engineers have been accepted into DesignCon’s "40 Under 40" program. Come meet them at the show!

DesignCon is helping engineer a bright future. The annual event for chip, board, and systems design engineers is enriching the education of 40 up-and-coming engineers in its 2025 40 Under 40 program. Selected through an open nomination and review process, these recipients will have full access to all DesignCon educational sessions, including its 15-track conference, as well as the expo floor and all networking sessions. These engineers will also be honored during an exclusive networking breakfast along with their highly regarded industry mentors and DesignCon speakers.
"With this sophomore edition of the DesignCon 40 Under 40 program, we are honored to celebrate this exceptional group of engineers, who will surely become next-generation leaders in the chip, board, and systems communities," says Suzanne Deffree, group event director for DesignCon. "Inspiration for not just today’s innovations but tomorrow’s has always been at the core of DesignCon. Being a part of these engineers’ education and career advancement through the 40 Under 40 program, that will continue to build the electronics industries, is fitting as DesignCon celebrates its 30th anniversary this January."
Program mentors include:
Maria Agoston, Principal Engineer, Tektronix
Eric Bogatin, Professor, University of Colorado, Boulder
Cathy Liu, Distinguished Engineer, Broadcom
Steve Sandler, President, Picotest
This year's 40 Under 40 group includes DesignCon first-timers as well as speakers at past shows and features engineers from around the world. The 40 Under 40 are:
Abhav Sahdev, Masters Student in High-Speed Digital Eng., University of Colorado Boulder
Abishek Manian, Analog Design Manager & Senior Member of Technical Staff, Texas Instruments
Anuj Sharma, Founder & CEO, Chip Web Technologies
Arno van Hoek, Experienced Hardware Engineer, Axis Communications AB
Asaad Kaadan, Founder, CEO & CTO, Hexabitz
Ashika Shaji Pandankeril, Staff R&D/Product DVL Engineer System Architecture, TE Connectivity
Byungjin Bae, Staff Engineer, Samsung Electronics
Cameron Refaee, Analog Design Engineer II, AMD
Chaofeng Li, Senior Engineer, Qualcomm
Clay Clemmer, Student, Solano Community College
Damon Choi, Field Application Engineer, Molex
Daniel Young, Vice President, Tecdia
Dhruv Chawla, Field Application Engineer, Molex
Eduardo Mendes, Digital Design Engineer, Kandou
Elizabeth Adams, UX Designer, Software Product Design, Tektronix
Emerald Smith, Founder & CEO, Emerald Consulting Group
Gajaba Wickramarathne, Field Sales Engineer, RF Associates - North
Garrett James Baldwin, Layout & Signal Integrity Engineer, Microchip Technology
Idan Ben Ezra, Hardware & Power Integrity Engineer, Broadcom
Imam Uddin, IC Systems Engineer, Broadcom
Jason Ruth, Field Application Engineer, Molex
Jeremy Cosson-Martin, Member of Technical Staff (MTS), AMD
Jiahui Tang, Analog Design Engineer, Texas Instruments
Jinal Shah, Co-founder, Indiesemic
Kang Xin, Developer, Ericsson
Lauren Waslick, Director of PCB Design, Newgrange Design
Liwei Zhao, HSIO System Modeling & Signal Integrity, Astera Labs
Majid Ahadi Dolatsara, Machine Learning R&D Engineer, Keysight Technologies
Matthew Haber, Co-Founder & CEO, Cofactr
Mayuresh Patki, SMTS Systems Design Engineer, AMD
Michael Derrenbacher, Design Verification Engineer, Texas Instruments
Naga Suryadevara, Principal EMC Engineer, Stealth AI Startup
Nicholas Matsumoto, Software Developer, Tektronix
Nikul Shah, Founder, Indiesemic
Priya Vemparala Guruswamy, MTS Silicon Design Engineer, SI/PI Applications, AMD
Qian Ding, Silicon Packaging Design Engineer, Intel PSG (Altera)
Ramnath Donthi Sanath Kumar, Hardware Engineer, Apple
Saish Sawant, Staff System Electrical Engineer, ZT Systems
Scott Witcher, Signal/Power Integrity Technical Staff, Chipletz
Seunghun Ryu, Ph.D. Student, Korea Advanced Institute of Science and Technology (KAIST)
Sukanta Dey, Senior EDA Tools Software Engineer, Intel
William McCaffrey, Digital Hardware Manager, Northrop Grumman
Xiuguo Jiang, Keysight SE Manager, Keysight
Yuandong Guo, Senior Member of Technical Staff, SI Engineer, AMD
The DesignCon 40 Under 40 program is sponsored by Amphenol, Samtec, and Design News.
DesignCon will be held Jan. 28-30. For more details, please click here.
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