DesignCon, the premier educational conference and technology exhibition for semiconductor and electronic design engineers, has announced the 2023 Call for Technical Papers, Panels, Tutorials, and Boot Camps. At DesignCon, engineers connect with engineers to find practical solutions to the challenging problems they share in design and verification. The conference emphasizes education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies. Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews.

DesignCon 2023 will take place January 31 to February 2, in Santa Clara, CA. Between now and July 27 you have the opportunity to submit your proposal for technical papers, panel discussions, tutorials, and boot camps to be presented at the conference.

With 14 tracks, DesignCon has information covering all aspects of hardware design, including high-speed serial design, signal and power integrity, interconnect modeling and analysis, and machine learning. Please look through the entire track list (halfway down the page) to choose the most appropriate track for your submission.

Each abstract will be reviewed by industry experts from the Technical Program Committee (TPC) and evaluated based on quality, relevance, impact, and originality. Submissions should be educational, informative, and avoid commercial content.

New to technical paper authorship? DesignCon’s mentorship program is ready to help you succeed. The TPC offers mentors for new and early-career lead authors. More information will be provided once your submission is accepted.

Session formats:

Submit your proposal now, before the July 27 deadline.