Check Out These Innovations From DesignCon 2025Check Out These Innovations From DesignCon 2025

Exhibitors at DesignCon 2025 showcased high-speed cables for ruggedized applications, interconnects to maintain signal integrity, innovations in test and measurement, and more solutions.

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Advanced products and technologies to solve vexing electronic design issues were on display at DesignCon.
A wide range of semiconductors, embedded systems, test equipment, and software greeted attendees on the busy DesignCon show floor this week. Daphne Allen

Demand for high-speed cable, interconnect, chip, and board solutions continues to grow, and the DesignCon 2025 exhibition delivered. The two-day exhibition at the Santa Clara Convention Center opened January 29 to attendees already in the midst of a robust education program that began January 28. The event features more than 170 exhibitors and 200 speakers appearing in technical sessions, panel discussions, tutorials, keynotes, and more.

Here are a few scenes and products from the show:

Smart cable modules with active electrical cables from Astera Labs

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Programmable power solutions from TDK Lambda Americas

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Signal integrity analyzer for testing passive or linear active interconnects from MultiLane

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IEEE 802.3dj cable compliance testing solutions from Rohde & Schwarz

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Signal quality analyzer from Anritsu

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Amphenol demonstrates liquid cooling

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Tektronix showing test solutions

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224 Gbps PAM4 demo

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About the Authors

Daphne Allen

Editor-in-Chief, Design News

Daphne Allen is editor-in-chief of Design News. She previously served as editor-in-chief of MD+DI and of Pharmaceutical & Medical Packaging News and also served as an editor for Packaging Digest. Daphne has covered design, manufacturing, materials, packaging, labeling, and regulatory issues for more than 20 years. She has also presented on these topics in several webinars and conferences, most recently discussing design and engineering trends at MD&M West 2024 and leading an Industry ShopTalk discussion during the show on artificial intelligence. She will be moderating the upcoming webinar, Best Practices in Medical Device Engineering and will be leading an Automation Tour at Advanced Manufacturing Minneapolis. She will also be attending DesignCon and MD&M West 2025.

Daphne has previously participated in meetings of the IoPP Medical Device Packaging Technical Committee and served as a judge in awards programs held by The Tube Council and the Healthcare Compliance Packaging Council. She also received the Bert Moore Excellence in Journalism Award in the AIM Awards in 2012.

Follow Daphne on X at @daphneallen and reach her at [email protected].

Spencer Chin

Senior Editor, Design News

Spencer Chin is a Senior Editor for Design News, covering the electronics beat, which includes semiconductors, components, power, embedded systems, artificial intelligence, augmented and virtual reality, and other related subjects. He is always open to ideas for coverage. Spencer has spent many years covering electronics for brands including Electronic Products, Electronic Buyers News, EE Times, Power Electronics, and electronics360. You can reach him at [email protected] or follow him at @spencerchin.

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