Do you know an engineer who goes above and beyond in the advancement of their field? Then it is time to nominate them for the DesignCon “Engineer of the Year” Award.
Each year during DesignCon, we recognize an engineer who is deemed by their peers to be the best of the best in engineering and new product advancements at the chip, board, or system level. The winner will be selected based on his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.
Last year we presented the award to Heidi Barnes. Known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies, Heidi serves on the DesignCon Technical Program Committee and leads conference planning as a co-chairperson for the test and measurement track. Other past winners have been industry icons Eric Bogatin in 2016, and Michael Steinberger in 2015.
Nominations are open from now until Thursday, January 4. Members of the Design News editorial staff will choose finalists from the nominees, and then the DesignCon and Design News communities will have the opportunity to vote for the engineer who will receive the 2018 Award.
The winner of DesignCon’s Engineer of the Year Award will be provided with a $10,000 grant or scholarship to present to the educational institution of his or her choice.
You may nominate multiple people for the award, but please only nominate each person once. Feel free to nominate yourself or another engineer.
Click here to go to the Nomination Form. https://www.surveymonkey.com/r/DZS88XX
By Engineers, For Engineers. Join our in-depth conference program with over 100 technical paper sessions, panels, and tutorials spanning 14 tracks. PLUS! New this year: Acquire an IEEE credit for every hour you spend at the conference. Learn more: DesignCon. Jan. 30-Feb. 1, 2018, in Santa Clara, CA. Register here for the event, hosted by Design News’ parent company UBM.