Do you know an engineer who goes above and beyond in the advancement of their field? Please nominate him or her to be the DesignCon 2019 “Engineer of the Year.”
Each year during DesignCon, we recognize an engineer who is deemed by their peers to be the best of the best in engineering and new product advancements at the chip, board, or system level. The winner will be selected based on his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.
Last year, we presented the award to Dr. Mike Peng Li. After delivering 19 years’ worth of tutorials and technical papers at DesignCon, Mike says the conference has become part of him. He has published approximately 110 technical papers, has earned 30 patents, has been named an IEEE Fellow, and has guided thousands of engineers, scientists, and students with his books and tutorials, especially in the area of jitter. Other past award winners have been industry greats Heidi Barnes in 2017, Eric Bogatin in 2016, and Michael Steinberger in 2015.
Nominations are open from now until Monday, December 3, 2018. Nominees must be active members of the DesignCon community to be considered for this award.
Members of the Design News editorial staff will choose finalists from the nominees, and then the DesignCon and Design News communities will have the opportunity to vote for the engineer who will receive the 2019 Award. Watch DesignNews.com for the announcement of the finalists and voting.
The winner of DesignCon’s Engineer of the Year Award will be provided with a $1,000 grant or scholarship to present to the educational institution of his or her choice.
You may nominate multiple people for the award, but please only nominate each person once. Multiple people nominating the same one engineer is encouraged. Feel free to nominate yourself or another engineer.
- Nomination Form
- Official Rules and Regulations of the Award
- Learn more about DesignCon and register for the event
|By Engineers, For Engineers. Join our in-depth conference program with over 100 technical paper sessions, panels, and tutorials spanning 15 tracks. Learn more: DesignCon. Jan. 29-31, 2019, in Santa Clara, CA. Register to attend, hosted by Design News’ parent company UBM.|