In a time crunch after the July fourth holiday week? Not a problem!
Design engineers now have an extra 11 days to fine-tune and submit their proposals to present a paper or tutorial, plan a boot camp or Chiphead Theater session, or even organize a panel discussion. The extended deadline to complete your DesignCon 2019 Call for Abstract submission is Monday, July 23.
Each abstract will be reviewed by industry experts in the DesignCon 2019 Technical Program Committee (TPC) and evaluated based on quality, relevance, impact, and originality. Submissions should be educational and informative and avoid commercial content. Presentation opportunities include 45-minute technical sessions, which require submission of a technical paper; 75-minute panel discussions; and 3-hour tutorials. Please submit through the electronic portal.
You may also submit a proposal for a full-day Boot Camp and Expo-floor Chiphead Theater sessions. Boot Camps provide an in-depth introduction to core DesignCon concepts, such as Signal Integrity, Power Integrity, PCB Fabrication, and Test & Measurement. Chiphead Theater sessions provide less technical content, such as teardowns, demos, and panels presented as 45-minute sessions that are open to all event attendees.
We are pleased to announce that we have added Track 15 covering Machine Learning for Microelectronics, Signaling & System Design. Please review all track descriptions and sample topics on the DesignCon website.
See you for DesignCon 2019 at the end of January!