Conexant's CX2070X products integrate anaudio/voice DSP, multi-bit codec, digital and analog input/out interfaces, andClass-D/PWM driver in a cost-effective single-chip package. The SoCs areavailable in multiple configurations. An embedded software configurationtoolbox allows developers to customize audio systems and optimize listeningexperiences. The devices feature a powerful suite of Conexant-developedtechnical innovations that dramatically improve audio/voice quality and enhanceuser experience including 3-D effects that use psychoacoustic algorithms towiden the sound output to its original stereo recording and create an immersivesurround effect. Theturnkey solutions enable a whole new class ofintegrated audio and voice products. The CX2070X integrates an audio/voice DSP, codec, and Class-D/PWMdriver into one chip. The SoCs enable engineers to design a wide range of audioand voice products, and feature multiple 24-bit DACs/ADCs, small profile, and excellent audio/voice processing algorithms: Subband AECeliminates speaker-to-microphone feedback; noise reduction eliminates ambientnear- and far-end noises; Subband LEC eliminates echo from twisted-paircrossover (a common problem in hybrid and intercom reference design).; 3DExpander widens the sound output from narrowly separated speakers; repositionsthe sound for an immersive surround effect and BrightSound^TM dramatically improves audio quality and reduces speaker clipping. The CX2070X is the nextgeneration of Conexant's Speakers-on-a-Chip (SPoC) products.The turnkeysolution lowers manufacturing costs by eliminating a multiple-chip design, andmakes it easy and economical for manufacturers to design products for audio andvoice applications faster. The CX2070X has unsurpassed audio and voiceprocessing algorithms that enable customization and superior quality.





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