DesignCon, premier event for chip, board, and systems design engineers, announces the top rated papers from the 2018 conference. DesignCon 2019 Call for Abstracts Opens Mid-May 2018.
Amidst all the gloom and doom scenarios around the Internet of Things and the potential for job loss, Cees Links has a more optimistic message, particularly for engineers.
Researchers at Dartmouth College have advanced 4D printing with a smart ink that turns 3D-printed structures into shape-shifting objects for biomedicine and beyond.
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