Nov 30 - Day 5: USB From the Host Side
Continuing Education Center 11/30/2012 218 comments Day 5 begins with a discussion of USB hosts, which are the most complex component in USB technology. We then are able to draw the differences between device, host, and on-the-go USB software stacks. The memory footprint for typical hosts and devices is described. Finally, the requirements for USB compliance are explained.
Nov 29 - Day 4: USB From the Device Side
Continuing Education Center 11/29/2012 238 comments Day 4 is all about USB devices -- what they are, and what they can be. When a USB device is first connected to the bus, it triggers a process called enumeration. This event is a crucial phase of the USB protocol. USB classes are also presented, which allow USB devices to take on multiple functions.
Nov 28 - Day 3: Understanding the USB Protocol
Continuing Education Center 11/28/2012 276 comments Day 3 presents the complex structure of the USB protocol, which operates above the basic level of transmission and reception of bits over copper wires. Discussed are the concepts of USB packets, transfers, transactions, frames, and endpoints. These concepts are essential to meet performance expectations.
Nov 27 - Day 2: USB Over a Single Wire Pair
Continuing Education Center 11/27/2012 263 comments Day 2 presents the methods and circuitry used in USB 1.1 and USB 2.0 to transmit and receive data over a single wire pair. The methods for USB 3.0 are also presented. The physical layer is examined. For compliance purposes, it is often sufficient to follow the semiconductor vendor reference designs.
Nov 26 - Day 1: Implementing USB in Embedded Products
Continuing Education Center 11/26/2012 295 comments Day 1 begins with a discussion about implementing USB technology in embedded products. This task can be challenging because of the restricted hardware resources available in embedded systems. USB topology is presented, which is a determining factor in what you can and cannot do with this technology. Finally, the mechanical specifications of USB are described.
Nov 30 - Day 5: USB From the Host Side
Continuing Education Center 11/30/2012 218 comments Day 5 begins with a discussion of USB hosts, which are the most complex component in USB technology. We then are able to draw the differences between device, host, and on-the-go USB software stacks. The memory footprint for typical hosts and devices is described. Finally, the requirements for USB compliance are explained.
Nov 29 - Day 4: USB From the Device Side
Continuing Education Center 11/29/2012 238 comments Day 4 is all about USB devices -- what they are, and what they can be. When a USB device is first connected to the bus, it triggers a process called enumeration. This event is a crucial phase of the USB protocol. USB classes are also presented, which allow USB devices to take on multiple functions.
Nov 28 - Day 3: Understanding the USB Protocol
Continuing Education Center 11/28/2012 276 comments Day 3 presents the complex structure of the USB protocol, which operates above the basic level of transmission and reception of bits over copper wires. Discussed are the concepts of USB packets, transfers, transactions, frames, and endpoints. These concepts are essential to meet performance expectations.
Nov 27 - Day 2: USB Over a Single Wire Pair
Continuing Education Center 11/27/2012 263 comments Day 2 presents the methods and circuitry used in USB 1.1 and USB 2.0 to transmit and receive data over a single wire pair. The methods for USB 3.0 are also presented. The physical layer is examined. For compliance purposes, it is often sufficient to follow the semiconductor vendor reference designs.
Nov 26 - Day 1: Implementing USB in Embedded Products
Continuing Education Center 11/26/2012 295 comments Day 1 begins with a discussion about implementing USB technology in embedded products. This task can be challenging because of the restricted hardware resources available in embedded systems. USB topology is presented, which is a determining factor in what you can and cannot do with this technology. Finally, the mechanical specifications of USB are described.
By refining topologies and using new fluid technology, Moog's new peak sine drive controller increases available power without increasing controller volume.
Lantronix Inc. has expanded its line of controllers for sensor networks with the release of a rugged controller that improves management of automation systems used in a number of industries, including manufacturing, oil and gas, and chemicals.
Inspired by the hooks a parasitic worm uses to penetrate its host's intestines, the Karp Lab has invented a flexible adhesive patch covered with microneedles that adheres well to wet, soft tissues, but doesn't cause damage when removed.
From Dell / Intel® New Paradigms in Design Work Scott Hamilton, vertical market strategist for Dell Precision workstations, 5/2/2013 3
Early in my career, I worked as a draftsman and remember the days of drawing on vellum with numbered pencils and Mylar with plastic lead. This was a fun experience in the sense that I ...
I've been using workstations for more than 10 years and love finding ways to get more performance from my system. With demanding professional applications that require more power each ...
A lasting memory from my first job as an engineer in an auto assembly plant is standing on hard concrete at six in the morning, vending-machine coffee clutched in hand, listening to ...
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is
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