Very interesting slide show. I have a Kindle Fire and definitely enjoy the package. I have about 40 or so books downloaded. The first week I had the device I dropped it down a flight of steps. My first impression was I'm in trouble here and a great Christmas present was trashed. To my surprise, there was no real damage at all and certainly none to the operation of the unit. Very fortunate here. I am amazed at the compact nature of these devices. Excellent effort in engineering.
It was an interesting teardown and the chip numbers help to understand the complexity a bit. I do wonder about the cable that was dispensed with early in the process, what did it do and how was it connected, and I also wonder if thisunit was ever returned to functionality. That would be an accomplishment to brag about. And it is much more fun to see a tear down with somebody else's device, not one that I paid for.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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