Ann, while I don't have a use for this information today, it is certainly handy to have. This source of knowledge is a resource, and like most resources becomes reallyn valuable wnen you need it, and only "interesting" the rest of the time. I can see an immediate application of this material in high frequency hiher power RF electrical applications.
What was not mentioned about the new material was outgassing, which affects the usefulness of a material for satellite and space applications, and also for semiconductor fabrication applications.
ON the issue of technical writing, DN has consistently evidenced that the deeper a technical issue is, the lesser the comments. (Case in point; this article). But I think that should be expected; -- for example, there have been several other deep articles from Guest Bloggers that I couldn't begin to comment on. The interested field of commenters just naturally narrows.
ON the subject of RIM, I was [minimally] familiar with another industrial process – Reaction Injection Molding (a different RIM) which is [loosely translated as] an injection of a 2-part epoxy. A very slow processing time because 'cure' is required. Checking my old faithful resource, Wikipedia doesn't have a page for your definition of RIM but does link it to your other suggested process, Resin Transfer (RTM).
Always interesting to learn about new things – Thanks!
Wow, thanks, Jim. I wasn't sure if readers wanted something this technical, but many discussions like this one just don't reduce down. RTM and RIM are standard processes that have been around awhile but not for high-performance materials like this one.
Last year at Hannover Fair, lots of people were talking about Industry 4.0. This is a concept that seems to have a different name in every region. I’ve been referring to it as the Industrial Internet of Things (IIoT), not to be confused with the plain old Internet of Things (IoT). Others refer to it as the Connected Industry, the smart factory concept, M2M, data extraction, and so on.
Some of the biggest self-assembled building blocks and structures made from engineered DNA have been developed by researchers at Harvard's Wyss Institute. The largest, a hexagonal prism, is one-tenth the size of an average bacterium.
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