Aviation, with its relatively low production volumes, seems to be a logical place to apply this technology. I do find it interesting, however, that the parts still require a wire EDM process after the fact.
AnandY, thanks for that detailed info on what GE Aviation is doing in its AM efforts.
As we mention in the article on the Lux Research 3D/AM report http://www.designnews.com/author.asp?section_id=1392&doc_id=262205 last fall GE Aviation acquired Morris Technologies http://www.geaviation.com/press/other/other_20121120.html, which was a 3D printing service bureau that produced mostly aerospace engine components.
Ann, this is an interesting trend in and it is typical of new technologies. It is also good to see it happening here. As AnandaY points out, Pratt & Whitney's biggest competitor is also starting to use this technology. Actually, GE is using a lot more ceramics and polymers in their engines, and that manufacturing is being brought in house as well.
Perhaps, as with the semiconductor industry, this will become a more standardized technology in the future. The trend in semiconductors is to seperate fabrication (fab) from design. On the other hand, in the early days of the insustry, it was fab that was the compettitive advantage. That is what allowed Intel to keep its lead for so long. On the other hand, Intel is now getting into the foundry business.
Aviation industries are shifting from traditional manufacturing to Additive Manufacturing. Genaral Electric have also shifted to AM. GE is preparing to produce a fuel nozzle for a new aircraft engine by printing the part with lasers rather than casting and welding the metal.
Engineers at Fuel Cell Energy have found a way to take advantage of a side reaction, unique to their carbonate fuel cell that has nothing to do with energy production, as a potential, cost-effective solution to capturing carbon from fossil fuel power plants.
To get to a trillion sensors in the IoT that we all look forward to, there are many challenges to commercialization that still remain, including interoperability, the lack of standards, and the issue of security, to name a few.
This is part one of an article discussing the University of Washington’s nationally ranked FSAE electric car (eCar) and combustible car (cCar). Stay tuned for part two, tomorrow, which will discuss the four unique PCBs used in both the eCar and cCars.
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