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Thanks all for joining!  If you have any additional questions, please contact me directly at David.Niewolny@freescale.com .  

There are really no limitations to the die you can include in an RCP design.  RCP can accomodate any die, any technology node, and use die designed for wire bond or flip chip. 

There are many reasons customers prefer ARM to other 32-bit architecture, but the two most common reasons are energy efficiency and software ecosystem.

David, Rich - Thank you both for a very informative session today! Great job!

Iron

To add what Rich mentioned about our involvement in the FDA, CE or any other healthcare regulatory organizations.  Component manufacturers cannot certify their parts via these organizations, but Freescale will provide to customers documents from our Quality Management System (QMS).  These documents are then provided to the FDA by the end customer as part of their FDA submission.  Information on Freescale's quality system can be found at www.freescale.com/quality

The couple packing technologies I discussed were Wafer Level Chip Scale Packaging (WL-CSP) and Redistributed Chip Packaging (RCP).  Wafer level CSP is a packaging technology where the pads may be etched or printed directly onto the silicon wafer resulting in a package very close to the size of the silicon die.  RCP is an interconnect buildup technology in which the package is a functional part of the die. The technology addresses the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics.  WL-CSP is the much more common technology.  RCP is a technology that significantly reduces size, but the technology is complex and it is only being offered to customers who really value its small size, such as those in the implantable market.

You can get more information on the Continua Health Alliance at www.continuaalliance.org/.

 

In general, the FDA does not get involved at the level that Freescale deals with. That's usually the responsibility and expertise of the device designer (and associated company). Although Freescale has some level of expertise to help along the way.

Blogger

The easiest way to reach Continua is via the web, at www.continuaalliance.org

Blogger

Why is ARM a better fit than some of the competitive architectures?

Iron

How are you determining what die to include in, for example, the 10-die integrated component you mentioned?

Iron

What IC packaging options are being considered?  WLP and ???

Iron

In attempting to shrink our next generation design, it has been suggested that we could use a via-in-pad design, even on passive components.  This could certainly by of great benefit on bypass caps that only connect to power planes, but can also help with general routing.

Are there any gotchas with this technology?

Iron

Where does the FDA fit in with the design of these products?

Iron

Another question: How can I get more information on Continua?

Iron

Greeting everyone!  Looking forward to our discussion.

Greetings everyone! The streaming audio player will appear on this web page when the show starts at 2:30 pm eastern today. Note however that some companies block live audio streams. If when the show starts you don't hear any audio, try refreshing your browser. You can hit the F5 key to refresh.

Iron

Looking forward to a great session. Ask questions if you have them.

Blogger

Greetings everyone! The streaming audio player will appear on this web page when the show starts at 12pm eastern today. Note however that some companies block live audio streams. If when the show starts you don't hear any audio, try refreshing your browser. You can hit the F5 key to refresh.

Iron


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