To add what Rich mentioned about our involvement in the FDA, CE or any other healthcare regulatory organizations. Component manufacturers cannot certify their parts via these organizations, but Freescale will provide to customers documents from our Quality Management System (QMS). These documents are then provided to the FDA by the end customer as part of their FDA submission. Information on Freescale's quality system can be found at www.freescale.com/quality.
The couple packing technologies I discussed were Wafer Level Chip Scale Packaging (WL-CSP) and Redistributed Chip Packaging (RCP). Wafer level CSP is a packaging technology where the pads may be etched or printed directly onto the silicon wafer resulting in a package very close to the size of the silicon die. RCP is an interconnect buildup technology in which the package is a functional part of the die. The technology addresses the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics. WL-CSP is the much more common technology. RCP is a technology that significantly reduces size, but the technology is complex and it is only being offered to customers who really value its small size, such as those in the implantable market.
In general, the FDA does not get involved at the level that Freescale deals with. That's usually the responsibility and expertise of the device designer (and associated company). Although Freescale has some level of expertise to help along the way.
In attempting to shrink our next generation design, it has been suggested that we could use a via-in-pad design, even on passive components. This could certainly by of great benefit on bypass caps that only connect to power planes, but can also help with general routing.
Greetings everyone! The streaming audio player will appear on this web page when the show starts at 2:30 pm eastern today. Note however that some companies block live audio streams. If when the show starts you don't hear any audio, try refreshing your browser. You can hit the F5 key to refresh.
Greetings everyone! The streaming audio player will appear on this web page when the show starts at 12pm eastern today. Note however that some companies block live audio streams. If when the show starts you don't hear any audio, try refreshing your browser. You can hit the F5 key to refresh.
Some cars are more reliable than others, but even the vehicles at the bottom of this year’s Consumer Reports reliability survey are vastly better than those of 20 years ago in the key areas of powertrain and hardware, experts said this week.
Many of the materials in this slideshow are resins or elastomers, plus reinforced materials, styrenics, and PLA masterbatches. Applications range from automotive and aerospace to industrial, consumer electronics and wearables, consumer goods, medical and healthcare, as well as sporting goods, and materials for protecting food and beverages.
While many larger companies are still reluctant to rely on wireless networks to transmit important information in industrial settings, there is an increasing acceptance rate of the newer, more robust wireless options that are now available.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.