To add what Rich mentioned about our involvement in the FDA, CE or any other healthcare regulatory organizations. Component manufacturers cannot certify their parts via these organizations, but Freescale will provide to customers documents from our Quality Management System (QMS). These documents are then provided to the FDA by the end customer as part of their FDA submission. Information on Freescale's quality system can be found at www.freescale.com/quality.
The couple packing technologies I discussed were Wafer Level Chip Scale Packaging (WL-CSP) and Redistributed Chip Packaging (RCP). Wafer level CSP is a packaging technology where the pads may be etched or printed directly onto the silicon wafer resulting in a package very close to the size of the silicon die. RCP is an interconnect buildup technology in which the package is a functional part of the die. The technology addresses the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics. WL-CSP is the much more common technology. RCP is a technology that significantly reduces size, but the technology is complex and it is only being offered to customers who really value its small size, such as those in the implantable market.
In general, the FDA does not get involved at the level that Freescale deals with. That's usually the responsibility and expertise of the device designer (and associated company). Although Freescale has some level of expertise to help along the way.
In attempting to shrink our next generation design, it has been suggested that we could use a via-in-pad design, even on passive components. This could certainly by of great benefit on bypass caps that only connect to power planes, but can also help with general routing.
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Earlier this year paralyzed IndyCar drive Sam Schmidt did the seemingly impossible -- opening the qualifying rounds at Indy by driving a modified Corvette C7 Stingray around the Indianapolis Motor Speedway.
Wearables are changing the way we see ourselves. With onboard sensors that have access to our bodies, we are starting to know our physical selves like never before, quantifying our activity, our heart rate, breathing, and even our muscle effort.
Last week, the bill for reforming chemical regulation, the TSCA Modernization Act of 2015, passed the House. If it or a similar bill becomes law, the effects on cost and availability of adhesives and plastics incorporating these substances are not yet clear.
This year, Design News is getting a head start on the Fourth of July celebration. In honor of our country and its legacy of engineering innovation -- in all of its forms -- we are taking you on an alphabetical tour through all 50 states to showcase interesting engineering breakthroughs and historically significant events.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.