@Chuck: I wrote an I2C/SMBus interface to a smart battery, which had a TI chipset for command/status info. It integrated sensors for temperature, voltage, current, as well as higher level status like State of Charge (integration of the charge/discharge status).
I'm told that the audio dropped out for many of you late in the session. For anyone who's interested, I'd like to repeat a question I asked at that time: Have you designed products that use smart sensors and, if so, what kinds of products were they? Thanks.
by plug and play, does this mean the sensor output would be the same from device to device.
That was the intent. A user could replace one sensor with another from the same or even a different manufacturer and the sensor had data regarding its calibration and other aspects that would have prevented it from being used in a system without additional effort from a knowledgible user. Industrial applications were the initial target of 1451.
@Chuck: I think a case study of the development of a smart sensor from concept (including the physics of the base sensor), through the design trades, to manufacturability issues, to deployment, would be interesting and helpful. This would perhaps some of the "hands on" flavor of Carol Lenk's latest LED session, or along the lines of some of Clive Maxfield's sessions such as the telescoped history of electronics he did for us a while back.
@rruther2: On my audio widget, it is the red triangle on the left end (in the leftmost box) of the widget. When you are actually listening, it is replacing by two vertical lines, presumably indicating Pause.
Load cells from Transducer Techniques use TEDS; saves me a lot of aggravation because it automatically scales the readout. I just plug in whichever load cell I'm using and the display and RS-232 output read directly in pounds with whatever resolution I selected previously.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.