It would be as if...instead of opening up a Photoshop file and giving it dimensions, you open up a hologram file and give it 3d dimensions. So you start with a given piece of clay. Future of modeling?
This might sound crazy, but what if. What if in the future an artist, say a sculpturist(?) instead of making a "real" model has a 3d hologram piece of clay. He/she sculpts that, with the help of a LEAP type input device, then just exports that hologram to a file and has it printed via a 3d printer. Am I crazy? Even if I am that sounds pretty neat to me.
Spot on, Cadman-LT. The combination of 3D technologies and the new haptics and user input devices like the Leap (all of which are taking a page from the gaming industry) are really pushing the 3D envelope. We'll see that experience translated into immersive virtual experiences like Giza and other historical endeavors, but will also see it making its way into full-blown engineering environments that will make the whole design experience much more interactive and immersive without having to have access to a multi-million virtual reality CAVE.
That seems to be the idea. I worked on a military project where they would have like to have had such a model of the battlefield. Back then we assumed that we would use holographic technology to do this.
Beth, thanks for reporting on this. As an archaeology fan and student, I think 3D and virtual reality are great technologies for teaching, especially about the past.
Take all of the 3D, combined with something like the new LEAP...hard to imagine what it will all lead to. It should prove to be very interesting though! From an engineering point it could and probably will totally change how things are designed. And that's just one thing.
For 3D printing to make the jump from rapid prototyping to manufacturing, engineers will need to find easier ways to move products from their CAD screens to their printers.
Gigabit and PoE are two networking technologies moving ahead in tandem as industrial users power remote Ethernet devices such as IP security cameras at 1,000 Mbps over existing CAT5 cable.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
From Dell / Intel® New Paradigms in Design Work Scott Hamilton, vertical market strategist for Dell Precision workstations, 5/2/2013 5
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