What kinds of yields are the manufacturers seeing (or accept to go into full production)?
When you mentioned Moore's law does not apply, it is from the physical (mechanical) rather than electrical issue with the device, I would expect given the types of materials available one reaches a physical/mechanical limitation.
Good presentation. Still digesting the phenomena ...
Interesting series. Interested in most of the mems sensor. I use them for low frequency noise detection. Seismic waves, Low Frequency Noise (LFN or Infrasound) from Wind Turbines, trains, roadway vibration etc.
There were about 10 posts below, before the lecture started, and there wasn't a single response saying they HAD received one. Surely it's not just a marketing trick to get us Engineering types to attend.
Alex, Still there? Did you notice all the concerns about the promised Gift Card? It isn't why I attend, but I must say I've been to at least 5 of these that promised a gift card, including a few over a month ago and never have received one.
someone asked about specs - all manufacturers list their tested specs, but the problem is there is no current standard for testing MEMS motion sensors. So you need to read the data sheet with a skeptical eye, and many system integrators choose to evaluate the MEMS motion sensors themselves instead of believing the spec sheet. I'm not saying the mfgs are dishonest, just that there can be a bit of specmanship.
More on caps to create hermetic cavities: polymer bonds are not hermetic enough for motion sensors, but might be ok for other sensor types. Most motion sensors are bonded via anodic bonding (glass to silicon) or gold-gold thermocompression. Some use glass frit, too. Temps are generally under 400C, but depends on bond type.
@ttodorov, who asked about power generation - yes, people are exploring MEMS as energy harvesters. Most approaches incorporate piezoelectric materials, which can transduce motion/strain into voltage. These type of harvesters can only produce nW, so not super useful at this point, until electronics become even lower power.
Regarding caps - is cathodic bonding the dominant mechanism of attachment, or can one use a low temp glass frit? What temp ranges are we speaking of during cathodic bonding and how low can the frits go? 250-300°C?
Do they use a polymer seal and call it 'hermetic'?
@eviscito, who asked about MEMS integration in ASICs - it can be done, but it depends on the MEMS architecture. Some MEMS can not be easily integrated with a CMOS process. Analog Devices has very successfully come up with a MEMS design that is integrated with their BiCMOS electronics. Ultimately, it's a cost and yield question. Most mfgrs. choose to process MEMS and CMOS wafers separately and then integrate at the package level, because it's cheaper!
@Alissa - I wonder if somebody is researching using MEMS (as mechanical devices) to generate electricity for picopower applications - like from wind or fluid motion, to work in difficult to reach areas (can't just go and replace the battery at the bottom of the ocean)
@naperlou, who asked about outputs: most MEMS accels and gyros have standard digital outputs, and i think you can get some accels to provide analog output. Most mfgrs these days are trying to make their sensors as "application ready" as possible, so they are providing firmware along with the sensors.
@Steven who posed a question about caps: all MEMS motion sensors need to be in a sealed, partial pressure environment. The easiest way to create a hermetic cavity is by bonding a rigid cap. there are some MEMS process methods whereby you can create very shallow cavities, but these approaches do not work for motion sensors. So generally, you're stuck bonding on another piece of silicon or glass to seal in the motion sensor.
For the majority of the MEMS devices shown in your presentation, is a Si 'cap' bonded to the peripheral face of the MEMS chip thereby creating the hermetic package which is subsequently wirebonded to a leadframe and over-molded - or is there another cheaper way to create the cavity in the molded package interior.
If not using a 'cap', is it really 'hermetic' and what might be the use environment limitations?
@Alex question: The most fascinating so far for me are the automotive performance computers.Push the suction cups onto the windshield, enter the car's weight and go.0-60 mph time, quarter mile time and much more...Great!
Consumers have no sense of sensors or what they are or whether or not they are in devices. My two cents. They just want to shift to landscape mode, for example, when they rotate their phone or tablets.
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The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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