From the design engineering standpoint, I think many people underestimate the packaging and assembly challenges inherent in such a tightly constrained design. This certainly applies to the Android phones and Blackberrys as well (though with the latter, not as much as here and with Android). Add to this the requirement for robustness, and you have a tough set of engineering requirements across the board.
I couldn't agree more, Rob. It also continues to amaze me, even at the end of 2011, that so much intuitive, cool technology fits into something so small and thin. I can't wait to see what features are showcased on the iPhone 5!
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This radio show will show what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.