Hi, Jim. Cypress takes the plug-in approach with its PSoC products and Microchip offers PICtail plug-in modules for its dev boards. Other MCU and even uP vendors have similar modular approaches. Like you, I remember the days of the expensive boards. Companies with big budgets might not balk at costly dev kits, but entrepreneurs who have cool ideas can't afford them just to test a concept. --Jon
This is a nice step in the right direction; first, with respect to the modular approach for design flexibility, and second, the low, low prices! It wasn’t long a go (circa 2002) that evaluation boards for the popular OMAP processors from Texas Instruments ran into multiple thousands of dollars for only a single Eval-Kit. (OK, so, granted the OMAP is a uP, and we’re talking sensors here, but the cost difference is remarkable!) And the modular approach is a great help for development engineers also. Final product layout always risks last-minute revisions, due to performance degradation from shields and other variables not considered on the bench-boards. Kudos to Freescale for addressing these two points.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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