And when dealing with saftey cost is geneally less of an issue. Great article by the way as well. Often saftey is so focused on the mechanical that the electrical can be missed. Much less individual components within the electrical system.
Sounds like TI built up a pretty impressive, layered diagnostic and self-testing architecture for this MCU series. Is this kind of layered approach common or is this a capability that's fairly unique to the Hercules line? If so, seems like it would give TI quite a competitive edge.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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