One of the reasons that temperature and power dissipation have become such large issues is that increased speed has increased the number of operations per second, while the power dissipation per operation has not dropped that much. The reason for the speed increase can be partly shown to be inefficient software, more commonly called "bloatware". Of course it is easier and faster to write, but poorly written code wastes power. The excuse for allowing code that is not efficient has been that memory and processing power were so cheap that they could make up for the poor code. Now it is becoming clear that this is a bad choice, since the devices have become so very small, leading to much higher power densities.
One means of reducing the heat load, then, would be to use better code, and slow down the processor a bit. Of course this will require a level of programming skill that is not very common, and also a reduction in the number of useles features that seem to be everywhere. But it is the one solution that does not wind up challenging the basic laws of physics.
Airborne is the first sector we'll see, with mini-drones already requiring DSP capability in a vastly shrunken space. Automotive is always a field ripe for more dashboard integration, but I'd expect medical electronics to increase demands fairly quickly. Medical record digitization has accelerated now that hospitals are accepting tablets as a better alternative than laptops, and this will drive an overall move to get patient data acquisition into handheld platforms whenever and wherever possible.
What's your sense of the thermal and packaging challenge in the embedded space as MCU vendors pack more and faster cores (dual core) into what used to be fairly standardized and not all that cutting edge parts?
Lantronix Inc. has expanded its line of controllers for sensor networks with the release of a rugged controller that improves management of automation systems used in a number of industries, including manufacturing, oil and gas, and chemicals.
Inspired by the hooks a parasitic worm uses to penetrate its host's intestines, the Karp Lab has invented a flexible adhesive patch covered with microneedles that adheres well to wet, soft tissues, but doesn't cause damage when removed.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is